About Us

About 

Butler Integration Solutions is an independent advisory practice specialising in semiconductor process integration, advanced packaging, and heterogeneous integration.

 The practice was founded on the recognition that advanced packaging has become the primary axis of semiconductor performance scaling — and that the expertise required to navigate it is genuinely scarce. As monolithic die scaling hits its limits, the industry has shifted to chiplet-based architectures, 2.5D and 3D integration, HBM memory stacking, and co-packaged optics. The technical and strategic decisions at this layer are consequential, complex, and poorly served by generalist advisors.

 The principal brings direct foundry experience across two greenfield-to-HVM fab programs — covering BEOL process integration, technology transfer, PDK development, yield and reliability maturation, and cross-functional program leadership across multinational teams. That experience spans 250nm through 90nm-class nodes in both aluminium and copper interconnect, with direct applicability to the advanced packaging and heterogeneous integration challenges the industry faces today.

Core technical competencies:

Process integration (BEOL, contact-to-die saw) | Interconnect architecture (Al & Cu, 250–90nm) | CMP | Inline metrology and SPC | Short & Full-flow integration splits and DOE | Yield and reliability analysis | PDK development and design-foundry interface | Technology transfer (copy-smart, greenfield ramp) | EDA collaboration | Advanced packaging (CoWoS, SoIC, chiplet, HBM, co-packaged optics)

Program and people competencies:

Cross-functional alignment across unit process, equipment, design, and customer teams | Multinational and multicultural team leadership | Crisis and escalation management | Technical conflict resolution and brokering | Integration governance and documentation

The practice operates globally from a base in Australia, with particular familiarity with the Asia-Pacific manufacturing ecosystem — TSMC, IMEC, Amkor Penang, SilTerra, and the broader OSAT supply chain — as well as the US advanced packaging buildout underway in Arizona and Texas.