Who We Work With

Semiconductor Manufacturers & OSATs 

Companies developing or scaling advanced packaging programs who need independent technical perspective — on architecture decisions, process integration, capability gaps, technology transfer, or competitive positioning.

Fabless Design Teams 

Engineering teams evaluating packaging approaches for next-generation products, particularly those navigating the chiplet transition, PDK compatibility questions, or co-packaged optics integration.

Venture Capital & Private Equity 

Investment teams conducting technical due diligence on semiconductor companies, or building conviction on advanced packaging as an investment theme.

Corporate Development & Strategy 

M&A and strategy teams at semiconductor companies who need independent technical assessment of acquisition targets or partnership candidates in the packaging and integration space.

Government & Sovereign Programs 

Advisory to government-backed semiconductor initiatives evaluating advanced packaging capability — including programs in Australia, the US CHIPS ecosystem, and bilateral AUKUS/Quad technology partnerships.

We work with clients globally. Engagements are conducted remotely or on-site as required.