Butler Integration Solutions

Semiconductor Process Integration & Advanced Packaging Advisory

The advanced packaging layer — CoWoS, chiplet integration, HBM, hybrid bonding, co-packaged optics — is now where semiconductor performance is won or lost. It is also where the most acute supply constraints, investment risk, and strategic decisions are concentrated.

But the hard problems at this layer are not only technical. They are organisational. Getting heterogeneous integration programs from concept to high-volume production requires process discipline, cross-functional alignment, and the ability to hold a clear integration strategy while the process is still being invented.

Butler Integration Solutions provides independent technical advisory services to semiconductor manufacturers, OSATs, deep-tech investors, and corporate development teams who need both kinds of expertise — deep process knowledge, and the program leadership experience to apply it.