What We Do

Process Integration Advisory

Independent technical advisory on semiconductor process integration — BEOL interconnect schemes, full-flow integration strategy, process window definition, and yield and reliability from early concept through HVM readiness. Relevant to advanced logic, memory, and mixed-device flows at nodes from mature to leading-edge.

Particular depth in aluminium and copper interconnect integration, CMP, alignment integration issues in lithography & inline metrology, and SPC at key integration checkpoints. Applicable to teams navigating advanced packaging flows including CoWoS, SoIC, and heterogeneous integration.

Technology Transfer & Fab Ramp Support

Advisory support for technology transfer programs and greenfield fab ramps — from process flow definition and traveller specification through copy-smart execution, yield maturation, and HVM production readiness.

 Drawing on direct experience across two successful greenfield-to-HVM programs: IBM-Toshiba embedded DRAM-logic transferred to GlobalFoundries Fab 3a/3b, and LSI Oregon manufacturing and IP transferred to SilTerra Malaysia. Both programs were carried through to volume production across diverse device architectures — logic, ASIC, SRAM, low and high voltage.

 Useful for companies standing up new advanced packaging or heterogeneous integration lines, qualifying new OSAT partners, or transferring process IP across companies, cultures & geographies.

PDK Development & Design-Foundry Interface

 Support for Process Design Kit development and the design-foundry interface — from test structure generation and process physics modelling through PDK parameter validation and design rule implementation for major customers.

 Relevant to foundries building out advanced packaging PDKs, fabless teams evaluating packaging process compatibility, and programs requiring rigorous process-design interaction validation before and through production.

Technical Due Diligence for Investors

 Independent technology assessment for venture capital, private equity, and corporate M&A teams evaluating semiconductor companies. We assess whether a company's packaging or integration technology is real, whether its roadmap is credible, and where the execution risks are. Delivered as a written report with clear findings and investment-relevant conclusions.

 Typical engagements: seed through pre-IPO; deal sizes from Series A through large-cap M&A.

Packaging Strategy & Architecture Review

 Independent review of heterogeneous integration approaches for semiconductor manufacturers and fabless design teams. This includes chiplet partitioning strategy, die-to-die interconnect selection (UCIe, HBM PHY, proprietary), substrate and interposer architecture, thermal and warpage management, and 2.5D/3D integration tradeoffs.

 Useful when an internal team wants an external perspective before committing to a packaging approach, or when a company is benchmarking its roadmap against industry direction.

Program Integration & Cross-Functional Alignment

 Advisory support for semiconductor programs where the integration challenge is as much organisational as technical — aligning unit process, equipment, design, EDA, and customer-facing teams around a shared integration strategy.

 This service is grounded in direct experience leading cross-functional integration across multinational teams in high-pressure, time-critical environments: yield excursion war rooms, tool-down escalations, and the kind of partisan technical disagreements that stall programs when left unresolved. The value is not arbitrating who is right — it is keeping all parties functioning as a coherent team while the answer is still being found.

 Relevant to companies running complex advanced packaging ramps, managing multi-vendor chiplet integration, or building new program teams across disparate geographies and cultures.

 All engagements are scoped individually. To discuss a project email: info@butlerintegrationsolutions.com